Lidrotec's wafer dicing machine uses ultrashort laser pulses to enable high-precision cutting, drilling and patterning on a variety of materials. Current methods produce up to 10% scrap. Lidrotec lowers this rate to 0%.

Lidrotec is a spin-off of Ruhr-Universität Bochum, Germany, specializing in laser processing in liquids to perform high-precision cutting of silicon wafers faster and more accurately than conventional methods. Lidrotec ́s wafer dicing machine uses ultrashort laser pulses to enable high-precision cutting, drilling and patterning on a variety of materials. Along with the laser, fluids are efficiently used in the laser processing zone to strongly cool the workpiece (wafer) and remove ablation products such as particles. Your product will be a standard plug-and-play laser machine.

The current method for cutting microchips uses a diamond saw. Up to 10% of microchips are damaged in this process, and $30 billion in damage is caused each year by cutting with a diamond saw. Lidrotec solves the problem of chip damage by using its dicing technology to produce perfectly usable microchips and reduce the damage rate to 0%.

The Lidrotec machine replaces the old machines without the need to change production processes. The advantages of this new method include no damaged chips, smaller cuts and higher output, variability in chip size, and the potential to be significantly faster than the old cutting techniques.