QuantumDiamonds' technology helps to solve the problem of failure analysis in novel manufacturing techniques in the semiconductor industry and to optimize manufacturing processes. The precise failure analysis and applicability to advanced technologies make QuantumDiamonds a promising solution to the challenges of modern manufacturing techniques.

In the age of heterointegration of various new materials, the three-dimensional stacking of chips and the increasing use of backside power supply, the challenges for error analysis are becoming ever greater. The individual chips are arranged on substrates with many contacts and tracks that are very close to each other. This makes it difficult to access the signals directly, especially if the fault only becomes visible in the fully integrated state. Defects in semiconductor components can cause expensive production errors. Even a small defect can render the entire production run unusable.

QuantumDiamonds' solution consists of a defect analysis method based on quantum sensor technology. This innovative technology enables the precise and non-destructive detection of multilayer currents and has the potential to establish the technology for quality control in production. Its solution can solve the challenges faced by conventional failure analysis methods due to novel manufacturing techniques. In addition, QuantumDiamonds has the potential to outperform current failure analysis tools for mature semiconductor manufacturing.