The chip is based on the proprietary CapRAM memcapacitor technology and enables in-memory computing. CapRAM offers up to 1000x higher power density, improved energy efficiency and a small footprint for edge AI.

Overheating is a common concern in high-performance devices, but Semron's chip design addresses this issue and ensures consistent functionality under demanding conditions. Semron is dedicated to high-performance edge AI applications found in smartphones, data glasses, AR/VR headsets and wearables. By improving performance, these chips help optimize the user experience in these devices.

CapRAM technology is at the heart of these chips and is characterized by an ingenious structure for precise weight calculations with minimal energy consumption. The chips are manufactured on a micro scale, allowing them to be integrated into compact devices without compromising performance. By using the crossbar array architecture, the chips enable efficient parallel operations that are ideal for web applications that require fast data processing.

To optimize storage space, Semron plans to use CapRAM memory in a stacked 3D form, similar to 3D NAND flash memory. This design optimizes storage and access to data. A key benefit of Semron's approach is the inherently low noise level, which contributes to stable performance and reduced overheating issues.

In the ever-changing digital landscape, Semron's AI chips offer promising advances in computing technology and contribute to greater energy efficiency and cost-effectiveness for websites and applications.