TeraSI is a company specializing in the manufacture of high performance waveguide components for applications above 60 GHz.

Silicon micromechanical techniques are used to create precise and compact mechanical structures in silicon wafers. These structures are coated with metal to function as electrical components. TeraSI provides innovative solutions for wireless applications, taking advantage of the scalability of conventional MEMS fabrication techniques.
TeraSI is a leading company specializing in the design and manufacture of high performance waveguide components for applications above 60 GHz. Using silicon micromechanical techniques, precise three-dimensional mechanical structures are created in silicon wafers. These structures are coated with metal to function as electrical components. TeraSI's innovative concept enables the production of extremely compact and precise components with exceptional electrical performance for wireless applications.
TeraSI's technology platform combines the advantages of conventional planar and waveguide structures into a single material/platform. The devices developed provide electrical performance comparable to three-dimensional waveguides, but with the form factor, volume and cost of conventional RF circuit boards. The company uses proven manufacturing techniques originally developed for the MEMS industry to produce waveguide components. The origins of this technology can be traced back to NASA's Jet Propulsion Laboratory (JPL), while the TeraSI team has expanded its expertise during a total of 15 years of academic research at KTH Royal Institute of Technology.
TeraSI's long-term goal is to create a new class of RF components and systems for use in large-scale 5G/6G applications. In particular, the company is focusing on developing system-in-package (SiP) solutions to address the biggest challenge on the way to complete systems: packaging and integration. The integration of heterogeneous 6G integrated circuits (ICs) sourced from commercial IC suppliers is a key aspect of TeraSI's solution. Tight integration and cooperative design of ICs with all-silicon SiP technology creates a scalable platform that overcomes previous limitations and enables cost-effective mass production.
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